Module-it designs robust, integrated turnkey infrastructure solutions, where each technical system is designed as a cohesive whole to ensure performance and safety—particularly in HPC and AI environments, where electrical loads, extreme thermal loads, and rapid equipment upgrades require seamless coordination of electrical, HVAC, and mechanical systems.
HPC & AI: The New Era of Data Center Densification
The rise of high-performance computing (HPC) and artificial intelligence (AI) is transforming data center architecture. Demands for computing power are skyrocketing, racks are reaching extreme densities, and power consumption and heat generation are creating unprecedented challenges. Some customers must urgently deploy HPC solutions, as they face the limitations of their current infrastructures. Close collaboration with IT manufacturers has become essential for designing coherent, high-performance, and sustainable infrastructures.
Module-it: 10 years of HPC expertise at the service of your projects
For the past decade, Module-it has been supporting its clients in the design and implementation of data centers tailored for high-performance computing. Our R&D teams develop agile, powerful, and secure solutions. Leveraging our partnerships with leading HPC infrastructure manufacturers, we collaborate with our clients to co-design 100% turnkey projects that integrate all critical technical and IT systems.
HPC & AI: Infrastructures Undergoing Rapid Change
The rapid growth in HPC demand is driving unprecedented power and cooling requirements, forcing a complete rethink of data center design.
A technological revolution in IT infrastructure
IT architectures are evolving rapidly with the rise of supercomputers, deep learning, and new GPU/CPU architectures. Infrastructure must keep pace with these changes to remain effective.
Unprecedented pressure on all technical departments
High-performance computing places heavy demands on all electrical, thermal, and physical systems. Only a comprehensive design that takes all interdependencies into account can ensure the system’s overall consistency and safety.
Accelerating the time-to-market for HPC projects
HPC projects must be deployed ever more quickly to address the strategic challenges faced by businesses and research laboratories.
Costs and Energy Consumption Under Constraints
Increased density leads to a sharp rise in electricity consumption. Energy efficiency is becoming a key factor in controlling operating costs.
New physical constraints for HPC racks
HPC bays can weigh over 1.5 tons and reach depths of 1,600 mm, requiring appropriate support structures and careful planning of the building layout.
Module-it: A modular solution tailored to HPC challenges
With 10 years of successful projects under our belt, we deploy modular solutions tailored to high-density HPC environments, notably through our prefabricated it-Box units, which are tested in our 1,500-square-meter workshop in Nantes.
Our expertise in HPC climate cooling incorporates the most advanced technologies: Direct Liquid Cooling (DLC), adiabatic free cooling, and hybrid systems tailored to each application. All our projects comply with ASHRAE standards, ensuring optimal equipment performance under controlled and safe thermal conditions.
Our HPC it-Boxes, designed and factory-pre-tested, enable the rapid, secure, and controlled deployment of high-performance computing infrastructures with managed production chains. Thanks to their wide range of form factors and capacities, our it-Boxes can be tailored to meet any requirement, whether it involves a few high-density racks or large-scale computing platforms.
Our management team, drawn from leading IT manufacturers, ensures seamless integration of the latest generations of CPUs, GPUs, and cooling systems, working closely with the manufacturers.
Every HPC project is co-designed with the client and IT vendors to quickly align functional, technical, and financial requirements and ensure a perfectly tailored solution. We incorporate detailed analyses of water flow rates (inlet and return temperatures), CPU and GPU heat dissipation, and their relative proportions within the architecture to ensure optimal thermal performance and the long-term reliability of the equipment.
Direct Liquid Cooling: Mastering Core Cooling
With its in-depth knowledge of CPUs, GPUs, and their thermal profiles, Module-it deploys comprehensive DLC solutions that integrate CDU units, manifolds, and in-house load testing to ensure performance. Our systems optimize water circuits with high inlet temperatures (up to 30–35°C), enabling efficient cooling while maximizing free cooling and reducing the data center’s overall energy consumption.
AI and HPC infrastructure is revolutionizing traditional data center architectures. We need to redesign the power and cooling systems that support these new infrastructures, which are 10 times denser than the ones we’ve grown accustomed to supporting.
Renaud, co-founder of Module-it
An integrator at the intersection of IT and infrastructure
Thanks to its partnerships with leading HPC manufacturers and its in-depth expertise in DLC technologies, Module-it serves as the natural bridge between IT operators and high-performance computing manufacturers. By systematically incorporating the latest innovations in cooling and power distribution, our solutions maximize the energy efficiency of infrastructure, significantly reduce operating costs, and actively contribute to the energy-efficiency goals of modern data centers.